Fluxless Flip-Chip Bonding Process Using Hydrogen Radical.

Details

Language :

English

ISBNs :

9781424421176

Database :

Complementary Index

Journal :

2008 10th Electronics Packaging Technology Conference

Publication Type :

Conference

Accession number :

80949809

Full Text :

https://doi.org/10.1109/EPTC.2008.4763498