The Redistributed Chip Package: A Breakthrough for Advanced Packaging.

Authors :: Keser, B.
Amrine, C.
Trung Duong
Fay, O.
Hayes, S.
Leal, G.
Lytle, W.
Mitchell, D.
Wenzel, R.
Source :: 2007 Proceedings 57th Electronic Components & Technology Conference; 2007, p286-291, 6p
Publication Year :: 2007

Language :: English
ISBNs :: 9781424409853
Database :: Complementary Index
Journal :: 2007 Proceedings 57th Electronic Components & Technology Conference
Publication Type :: Conference
Accession number :: 80945777
Full Text :: https://doi.org/10.1109/ECTC.2007.373811