Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board).

Details

Language :

English

ISBNs :

9781424419098

Database :

Complementary Index

Journal :

2007 International Conference on Electronic Materials & Packaging

Publication Type :

Conference

Accession number :

80934345

Full Text :

https://doi.org/10.1109/EMAP.2007.4510284