Back to Search Start Over

Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis.

Authors :
Anzawa, T.
Qiang Yu
Shibutani, T.
Shiratori, M.
Source :
2007 9th Electronics Packaging Technology Conference; 2007, p94-99, 6p
Publication Year :
2007

Details

Language :
English
ISBNs :
9781424413232
Database :
Complementary Index
Journal :
2007 9th Electronics Packaging Technology Conference
Publication Type :
Conference
Accession number :
80878348
Full Text :
https://doi.org/10.1109/EPTC.2007.4469833