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Reliability Evaluation for Power Electronics Device using Electrical Thermal and Mechanical Analysis.
- Source :
- 2007 9th Electronics Packaging Technology Conference; 2007, p94-99, 6p
- Publication Year :
- 2007
Details
- Language :
- English
- ISBNs :
- 9781424413232
- Database :
- Complementary Index
- Journal :
- 2007 9th Electronics Packaging Technology Conference
- Publication Type :
- Conference
- Accession number :
- 80878348
- Full Text :
- https://doi.org/10.1109/EPTC.2007.4469833