Evaluating fine-pitch chip-on-flex with non-conductive film by using multi-points compliant bump structure.

Details

Language :

English

ISBNs :

9781424406647

Database :

Complementary Index

Journal :

2006 8th Electronics Packaging Technology Conference

Publication Type :

Conference

Accession number :

80811342

Full Text :

https://doi.org/10.1109/EPTC.2006.342737