Cite
Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning.
MLA
Ebbens, S., et al. “Investigation of Ink-Jet Printing of Self-Assembled Monolayers for Copper Circuit Patterning.” 2006 8th Electronics Packaging Technology Conference, Jan. 2006, pp. 46–52. EBSCOhost, https://doi.org/10.1109/EPTC.2006.342689.
APA
Ebbens, S., Hutt, D. A., & Changqing Liu. (2006). Investigation of ink-jet printing of self-assembled monolayers for copper circuit patterning. 2006 8th Electronics Packaging Technology Conference, 46–52. https://doi.org/10.1109/EPTC.2006.342689
Chicago
Ebbens, S., D.A. Hutt, and Changqing Liu. 2006. “Investigation of Ink-Jet Printing of Self-Assembled Monolayers for Copper Circuit Patterning.” 2006 8th Electronics Packaging Technology Conference, January, 46–52. doi:10.1109/EPTC.2006.342689.