The Reliability Research of Lead-Free Solder Joint of Flip-Chip.

Details

Language :

English

ISBNs :

9781424406197

Database :

Complementary Index

Journal :

2006 7th International Conference on Electronic Packaging Technology

Publication Type :

Conference

Accession number :

80810771

Full Text :

https://doi.org/10.1109/ICEPT.2006.359656