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Studies on a novel flip-chip interconnect structure - pillar bump.
- Source :
- 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220); 2001, p933-937, 5p
- Publication Year :
- 2001
Details
- Language :
- English
- ISBNs :
- 9780780370388
- Database :
- Complementary Index
- Journal :
- 2001 Proceedings 51st Electronic Components & Technology Conference (Cat. No.01CH37220)
- Publication Type :
- Conference
- Accession number :
- 80770122
- Full Text :
- https://doi.org/10.1109/ECTC.2001.927917