Invasion percolation model for abnormal TDDB characteristic of ULK dielectrics with Cu interconnect at advanced technology nodes.

Details

Language :

English

ISBNs :

9781424491131

Database :

Complementary Index

Journal :

2011 IEEE International Reliability Physics Symposium (IRPS)

Publication Type :

Conference

Accession number :

80408610

Full Text :

https://doi.org/10.1109/IRPS.2011.5784466