Thermal imaging for reliability characterization of copper vias.

Authors :: Alavi, S.
Yazawa, K.
Alers, G.
Vermeersch, B.
Christofferson, J.
Shakouri, A.
Source :: 2011 27th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM); 2011, p17-20, 4p
Publication Year :: 2011

Language :: English
ISBNs :: 9781612847405
Database :: Complementary Index
Journal :: 2011 27th Annual IEEE Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM)
Publication Type :: Conference
Accession number :: 80393860
Full Text :: https://doi.org/10.1109/STHERM.2011.5767172