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Metal grain suppression and DOI capture rate improvement in 32 nm technology node.

Authors :
Hsiao-Leng Li
Che-Lung Hung
Tuung Luoh
Ling-Wu Yang
Tahone Yang
Kuang-Chao Chen
Chih-Yuan Lu
Source :
2011 International Symposium on Semiconductor Manufacturing (ISSM) & e-Manufacturing & Design Collaboration Symposium (eMDC); 2011, p1-15, 15p
Publication Year :
2011

Details

Language :
English
ISBNs :
9781457716478
Database :
Complementary Index
Journal :
2011 International Symposium on Semiconductor Manufacturing (ISSM) & e-Manufacturing & Design Collaboration Symposium (eMDC)
Publication Type :
Conference
Accession number :
80393824

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