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Finite-element based comparative analysis of the thermo-mechanical stresses affecting Si and SiC power switches.

Authors :
Escrouzailles, V.
Castellazzi, A.
Solomalala, P.
Mermet-Guyennet, M.
Source :
2011 IEEE 8th International Conference on Power Electronics & ECCE Asia (ICPE & ECCE); 2011, p1077-1082, 6p
Publication Year :
2011

Details

Language :
English
ISBNs :
9781612849584
Database :
Complementary Index
Journal :
2011 IEEE 8th International Conference on Power Electronics & ECCE Asia (ICPE & ECCE)
Publication Type :
Conference
Accession number :
80392371
Full Text :
https://doi.org/10.1109/ICPE.2011.5944657