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Finite-element based comparative analysis of the thermo-mechanical stresses affecting Si and SiC power switches.
- Source :
- 2011 IEEE 8th International Conference on Power Electronics & ECCE Asia (ICPE & ECCE); 2011, p1077-1082, 6p
- Publication Year :
- 2011
Details
- Language :
- English
- ISBNs :
- 9781612849584
- Database :
- Complementary Index
- Journal :
- 2011 IEEE 8th International Conference on Power Electronics & ECCE Asia (ICPE & ECCE)
- Publication Type :
- Conference
- Accession number :
- 80392371
- Full Text :
- https://doi.org/10.1109/ICPE.2011.5944657