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Enabling Cu-Cu connection in (dual) damascene interconnects by selective deposition of two different SAM molecules.

Authors :
Maestre Caro, A.
Travaly, Y.
Maes, G.
Borghs, G.
Armini, S.
Source :
Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International; 2011, p1-3, 3p
Publication Year :
2011

Details

Language :
English
ISBNs :
9781457705038
Database :
Complementary Index
Journal :
Interconnect Technology Conference & 2011 Materials for Advanced Metallization (IITC/MAM), 2011 IEEE International
Publication Type :
Conference
Accession number :
80323876
Full Text :
https://doi.org/10.1109/IITC.2011.5940263
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