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Electromigration behavior in in-situ Cu6Sn5 reinforced eutectic SnAg composite solder joints.

Authors :
Xiaoya Wang
Mengting Han
Liming Ma
Guangchen Xu
Fu Guo
Source :
2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP); 2011, p1-5, 5p
Publication Year :
2011

Details

Language :
English
ISBNs :
9781457717703
Database :
Complementary Index
Journal :
2011 12th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP)
Publication Type :
Conference
Accession number :
80299922
Full Text :
https://doi.org/10.1109/ICEPT.2011.6066821
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