High-resolution resist for screen printing: application to direct fabrication of Ag circuit.

High-resolution screen printing was devised. New resist formulation contains a base polymer, which consists of acid-labile tetrahydropyranyl-protected carboxylic acid, hydroxyl, and methacrylic functions. As crosslinkers, multifunctional acrylates were employed. Photoacid generators were used for pattern formation. A 10-µm feature size of resist on a screen plate was obtained on irradiation at 365 nm and followed by development on a stainless steel screen. Post-exposure curing improved the mechanical characteristics of the resist patterns. A 13-µm feature size silver circuit was successfully printed on poly(ethylene terephthalate) film without defect. Copyright © 2011 John Wiley & Sons, Ltd. [ABSTRACT FROM AUTHOR]