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The high-temperature stability of chemically vapor-deposited tungsten-silicon couples rapid thermal annealed in ammonia and argon.

Authors :
Broadbent, E. K.
Morgan, A. E.
Flanner, J. M.
Coulman, B.
Sadana, D. K.
Burrow, B. J.
Ellwanger, R. C.
Source :
Journal of Applied Physics; 12/15/1988, Vol. 64 Issue 12, p6721, 6p
Publication Year :
1988

Abstract

Presents information on a study which evaluated the feasibility of suppressing silicide formation by incorporating nitrogen into the chemically vapor deposited tungsten film prior to subsequent high-temperature processing. Methodology of the study; Results and discussion; Conclusion.

Subjects

Subjects :
SILICIDES
TUNGSTEN
THIN films

Details

Language :
English
ISSN :
00218979
Volume :
64
Issue :
12
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
7653356
Full Text :
https://doi.org/10.1063/1.342003