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Low-temperature copper etching via reactions with Cl2 and PEt3 under ultrahigh vacuum conditions.
- Source :
- Journal of Applied Physics; 2/1/1993, Vol. 73 Issue 3, p1455, 6p, 1 Chart, 7 Graphs
- Publication Year :
- 1993
-
Abstract
- Presents information on a study which investigated the adsorption and desorption behavior of PEt[sub3] on copper and chlorinated copper surfaces under ultrahigh vacuum conditions. Experimental procedures; Results and discussion; Conclusion.
- Subjects :
- COPPER absorption & adsorption
COPPER surfaces
ULTRAHIGH vacuum
Subjects
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 73
- Issue :
- 3
- Database :
- Complementary Index
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 7650495
- Full Text :
- https://doi.org/10.1063/1.353219