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Formation of copper patterns on poly(tetrafluoroethylene) via radiation controlled chemical etching and chemical-vapor deposition.

Authors :
Rye, R. R.
Knapp, J. A.
Chi, K.-M.
Hampden-Smith, M. J.
Kodas, T. T.
Source :
Journal of Applied Physics; 12/15/1992, Vol. 72 Issue 12, p5941, 7p, 5 Black and White Photographs, 1 Diagram, 3 Graphs
Publication Year :
1992

Abstract

Presents a study which described the formation of copper patterns on poly(tetrafluoroethylene) (PTFE) via radiation controlled chemical etching and chemical-vapor deposition. Process of the deposition of patterned copper films on poly(tetrafluoroethylene); Metal that has a low resistivity than copper; Factor that makes it difficult for PTFE to metallize; Use of copper films as Celerier and Machet point out.

Details

Language :
English
ISSN :
00218979
Volume :
72
Issue :
12
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
7628161
Full Text :
https://doi.org/10.1063/1.351902