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Formation of copper patterns on poly(tetrafluoroethylene) via radiation controlled chemical etching and chemical-vapor deposition.
- Source :
- Journal of Applied Physics; 12/15/1992, Vol. 72 Issue 12, p5941, 7p, 5 Black and White Photographs, 1 Diagram, 3 Graphs
- Publication Year :
- 1992
-
Abstract
- Presents a study which described the formation of copper patterns on poly(tetrafluoroethylene) (PTFE) via radiation controlled chemical etching and chemical-vapor deposition. Process of the deposition of patterned copper films on poly(tetrafluoroethylene); Metal that has a low resistivity than copper; Factor that makes it difficult for PTFE to metallize; Use of copper films as Celerier and Machet point out.
- Subjects :
- COPPER
RADIATION
SEMICONDUCTOR etching
CHEMICAL vapor deposition
THIN films
Subjects
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 72
- Issue :
- 12
- Database :
- Complementary Index
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 7628161
- Full Text :
- https://doi.org/10.1063/1.351902