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Effect of the Ti/TiN bilayer barrier and its surface treatment on the reliability of a Ti/TiN/AlSiCu/TiN contact metallization.
- Source :
- Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1996, Vol. 14 Issue 6, p3502-3508, 7p
- Publication Year :
- 1996
Details
- Language :
- English
- ISSN :
- 10711023
- Volume :
- 14
- Issue :
- 6
- Database :
- Complementary Index
- Journal :
- Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures
- Publication Type :
- Academic Journal
- Accession number :
- 74342177
- Full Text :
- https://doi.org/10.1116/1.588788