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Effect of the Ti/TiN bilayer barrier and its surface treatment on the reliability of a Ti/TiN/AlSiCu/TiN contact metallization.

Authors :
Ouellet, L.
Tremblay, Y.
Gagnon, G.
Caron, M.
Currie, J. F.
Gujrathi, S. C.
Biberger, M.
Source :
Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1996, Vol. 14 Issue 6, p3502-3508, 7p
Publication Year :
1996

Details

Language :
English
ISSN :
10711023
Volume :
14
Issue :
6
Database :
Complementary Index
Journal :
Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures
Publication Type :
Academic Journal
Accession number :
74342177
Full Text :
https://doi.org/10.1116/1.588788