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Planar-processed tungsten and polysilicon vacuum microelectronic devices with integral cavity sealing.

Authors :
Mei, Q.
Tamagawa, T.
Ye, C.
Lin, Y.
Zurn, S.
Polla, D. L.
Source :
Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures; 1993, Vol. 11 Issue 2, p493-496, 4p
Publication Year :
1993

Details

Language :
English
ISSN :
10711023
Volume :
11
Issue :
2
Database :
Complementary Index
Journal :
Journal of Vacuum Science & Technology: Part B-Microelectronics & Nanometer Structures
Publication Type :
Academic Journal
Accession number :
74339474
Full Text :
https://doi.org/10.1116/1.586848