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Failure analysis of wafer-level reliability testing failure.

Authors :
Oh, Chong K.
Neo, Soh P.
Bi, Jian H.
Wu, Zong M.
Goh, Lian C.
Redkar, Shailesh
Source :
Proceedings of SPIE; Nov1999, Issue 1, p228-235, 8p
Publication Year :
1999

Details

Language :
English
ISSN :
0277786X
Issue :
1
Database :
Complementary Index
Journal :
Proceedings of SPIE
Publication Type :
Conference
Accession number :
65885479
Full Text :
https://doi.org/10.1117/12.361354