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DROP IMPACT ANALYSIS ON THE PACKAGING SYSTEM USING HONEYCOMB PAPERBOARD.

Authors :
LV, YUAN-JUN
CHEN, QIONG
Source :
Journal of Advanced Manufacturing Systems; Jun2011, Vol. 10 Issue 1, p167-174, 8p, 3 Diagrams, 2 Charts, 3 Graphs
Publication Year :
2011

Abstract

A packaging system using the material of honeycomb paperboard, when it is subjected to drop impact, is a major concern to manufacturers as it relates to the maximum stress causing failure. In this work, the full-field dynamic responses of product packaging system are measured and analyzed in detail with the simulation and experiment method. First, on the basis of theoretical analysis, a series of honeycomb paperboards with different size dimension of paper honeycomb core had been set up in the FEA software. Then a packaging system which is made up of rigid body and deformable body had been analyzed. The results show that the physical dimension of paper honeycomb core has a great effect on its impact resistance: with the increasing size dimension, the peak acceleration has a quickly alteration within 10 mm-20 mm, but in other region it has an effect in the form of up and down fluctuation. At the same time, with the increasing size dimension, honeycomb paperboard can improve the energy absorption ability in the condition of elastic deformation. The research results can be used to optimize the structure design and material selection. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
02196867
Volume :
10
Issue :
1
Database :
Complementary Index
Journal :
Journal of Advanced Manufacturing Systems
Publication Type :
Academic Journal
Accession number :
62248910
Full Text :
https://doi.org/10.1142/S0219686711002119