Physical failure analysis deprocessing and cross-section techniques for Cu/low-k technology.

MLA

Huixian Wu, et al. “Physical Failure Analysis Deprocessing and Cross-Section Techniques for Cu/Low-k Technology.” IEEE Transactions on Device & Materials Reliability, vol. 4, no. 1, Mar. 2004, pp. 11–17. EBSCOhost, https://doi.org/10.1109/TDMR.2004.824358.

APA

Huixian Wu, Hooghan, K., & Cargo, J. (2004). Physical failure analysis deprocessing and cross-section techniques for Cu/low-k technology. IEEE Transactions on Device & Materials Reliability, 4(1), 11–17. https://doi.org/10.1109/TDMR.2004.824358

Chicago

Huixian Wu, K. Hooghan, and J. Cargo. 2004. “Physical Failure Analysis Deprocessing and Cross-Section Techniques for Cu/Low-k Technology.” IEEE Transactions on Device & Materials Reliability 4 (1): 11–17. doi:10.1109/TDMR.2004.824358.