Design Envelopes and Optical Feature Extraction Techniques for Survivability of SnAg Lead-free Packaging Architectures Under Shock and Vibration.

Details

Language :

English

ISSN :

1521334X

Volume :

32

Issue :

4

Database :

Complementary Index

Journal :

IEEE Transactions on Electronics Packaging Manufacturing

Publication Type :

Academic Journal

Accession number :

50252875

Full Text :

https://doi.org/10.1109/TEPM.2009.2031873