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Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution.
- Source :
- IEEE Transactions on Device & Materials Reliability; Mar2010, Vol. 10 Issue 1, p149-156, 8p
- Publication Year :
- 2010
Details
- Language :
- English
- ISSN :
- 15304388
- Volume :
- 10
- Issue :
- 1
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Device & Materials Reliability
- Publication Type :
- Academic Journal
- Accession number :
- 50141071
- Full Text :
- https://doi.org/10.1109/TDMR.2009.2037141