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Effect of Dicing Technique on the Fracture Strength of Si Dies With Emphasis on Multimodal Failure Distribution.

Authors :
Seung-Hyun Chae
Jie-Hua Zhao
Edwards, Darvin R.
Ho, Paul S.
Source :
IEEE Transactions on Device & Materials Reliability; Mar2010, Vol. 10 Issue 1, p149-156, 8p
Publication Year :
2010

Details

Language :
English
ISSN :
15304388
Volume :
10
Issue :
1
Database :
Complementary Index
Journal :
IEEE Transactions on Device & Materials Reliability
Publication Type :
Academic Journal
Accession number :
50141071
Full Text :
https://doi.org/10.1109/TDMR.2009.2037141