The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure.

MLA

Zribi, A., et al. “The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure.” Journal of Electronic Materials, vol. 30, no. 9, Sept. 2001, pp. 1157–64. EBSCOhost, https://doi.org/10.1007/s11664-001-0144-6.

APA

Zribi, A., Clark, A., Zavalij, L., Borgesen, P., & Cotts, E. (2001). The growth of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu solder/Ni interfaces and the associated evolution of the solder microstructure. Journal of Electronic Materials, 30(9), 1157–1164. https://doi.org/10.1007/s11664-001-0144-6

Chicago

Zribi, A., A. Clark, L. Zavalij, P. Borgesen, and E. Cotts. 2001. “The Growth of Intermetallic Compounds at Sn-Ag-Cu Solder/Cu and Sn-Ag-Cu Solder/Ni Interfaces and the Associated Evolution of the Solder Microstructure.” Journal of Electronic Materials 30 (9): 1157–64. doi:10.1007/s11664-001-0144-6.