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On the Way to Zero Defect of Plastic-Encapsulated Electronic Power Devices--Part II: Molding Compound.
- Source :
- IEEE Transactions on Device & Materials Reliability; Jun2009, Vol. 9 Issue 2, p279-287, 9p
- Publication Year :
- 2009
Details
- Language :
- English
- ISSN :
- 15304388
- Volume :
- 9
- Issue :
- 2
- Database :
- Complementary Index
- Journal :
- IEEE Transactions on Device & Materials Reliability
- Publication Type :
- Academic Journal
- Accession number :
- 49846170
- Full Text :
- https://doi.org/10.1109/TDMR.2009.2018655