Thermal stability dependence on the stacking order and thickness ratio of the CoPt–TiO2/CoCrPt–SiO2 stacked media.

Thermal stability of the present CoCrPt–SiO₂ media becomes a more critical issue as recording density steadily increases. In the present study, thermal stability of the stacked media composed of high K_u CoPt–TiO₂ and normal K_u CoCrPt–SiO₂ was studied by changing stacking order and thickness of each layer while keeping a constant total thickness. When the CoPt–TiO₂ layer was placed under the CoCrPt–SiO₂ layer, negative nucleation field and coercivity increased much more than those of the reverse stacking case. Thermal stability of the CoPt–TiO₂ bottom group was superior to that of the CoCrPt–SiO₂ bottom group when measured by a spin stand. [ABSTRACT FROM AUTHOR]