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Interfacial microstructure of Si3N4/Si3N4 joint brazed using Au–Ni–V filler alloy.

Authors :
Zhang, J.
Sun, Y.
Liu, C. F.
Zhang, H. W.
Source :
Journal of Materials Science; Apr2010, Vol. 45 Issue 8, p2188-2193, 6p, 5 Diagrams, 1 Chart, 3 Graphs
Publication Year :
2010

Abstract

By using Au58.74Ni36.50V4.76 at.% filler alloy, a reliable Si<subscript>3</subscript>N<subscript>4</subscript>/Si<subscript>3</subscript>N<subscript>4</subscript> joint was brazed at 1,423 K for 60 min in vacuum. The microstructure of the joint was investigated and analyzed by scanning electron microscope with energy dispersive spectroscopy, transmission electron microscopy, and X-ray diffraction. The results indicate that the joint consists of three main phases: a continuous VN reaction layer between filler alloy and Si<subscript>3</subscript>N<subscript>4</subscript> ceramic; an Au[Ni] solid solution as the matrix of the joint; and Ni[Si,V] solid solution particles distributed homogeneously in the Au[Ni] solid solution. The mechanism of formation of the interfacial structure is discussed. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00222461
Volume :
45
Issue :
8
Database :
Complementary Index
Journal :
Journal of Materials Science
Publication Type :
Academic Journal
Accession number :
48147990
Full Text :
https://doi.org/10.1007/s10853-009-4132-1