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The determination of phases formed in AISiCu/Tin/Ti contact metallization structure of integrated...

Authors :
Fortin, V.
Gagnon, G.
Caron, M.
Gujrathi, S. C.
Currie, J. F.
Ouellet, L.
Tremblay, Y.
Biberger, M.
Source :
Journal of Applied Physics; 1/1/1998, Vol. 83 Issue 1, p132, 7p, 1 Black and White Photograph, 1 Chart, 5 Graphs
Publication Year :
1998

Abstract

Presents a study which eamines x-ray diffraction (XRD) results that will be useful to understand and explain the main effects on the TiN barrier integrity due to the annealing temperature, the air exposure, the ARC layer, the TiN thickness and the substrate. Formation of phases at Al alloy TiN interface; Discussion and results of the study; Discussion on circuit problems.

Subjects

Subjects :
X-ray diffractometers

Details

Language :
English
ISSN :
00218979
Volume :
83
Issue :
1
Database :
Complementary Index
Journal :
Journal of Applied Physics
Publication Type :
Academic Journal
Accession number :
44931
Full Text :
https://doi.org/10.1063/1.366710