Stress determination in nickel monosilicide films using x-ray diffraction.

Lattice spacing measurements of the (211)/(202), (020)/(013), and (111)/(102) reflections were used to calculate the residual stresses in a Ni monosilicide film after cooling from its formation temperature. The ability to measure stresses in crystalline materials using x-ray diffraction requires the use of appropriate x-ray elastic constants, which link the measured strain to the stress tensor of the grains that satisfy the diffraction condition. X-ray elastic constants were calculated in the Neerfeld–Hill (NH) limit for a polycrystalline aggregate composed of orthorhombic crystals. The anisotropy in grains that possess orthorhombic elasticity introduces significant variation in the stresses determined among the three sets of reflections. However, the in-plane stress calculated due to thermal expansion mismatch between NiSi and the underlying Si substrate shows a close correspondence to the average of x-ray measurements. [ABSTRACT FROM AUTHOR]