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Cross-Interaction Between Au/Sn and Cu/Sn Interfacial Reactions.
- Source :
- Journal of Electronic Materials; Nov2009, Vol. 38 Issue 11, p2257-2263, 7p, 9 Black and White Photographs, 1 Diagram, 5 Graphs
- Publication Year :
- 2009
-
Abstract
- The cross-interaction between Sn/Cu and Sn/Au interfacial reactions in an Au/Sn/Cu sandwich structure was studied. Field-emission electron probe microanalysis (FE-EPMA) revealed that the Cu content in the three Au-Sn phases (AuSn, AuSn<subscript>2</subscript>, and AuSn<subscript>4</subscript>) was very low, less than 1 at.%. This meansā£that Cu from the opposite Cu foil did not participate in the interfacial reaction at the Sn/Au interface. On the opposite Sn/Cu side, Au-substituted (Cu,Au)<subscript>6</subscript>Sn<subscript>5</subscript> formed within the initial 1 min of reflow. With prolonged reflow, the Au content in the Au-substituted (Cu,Au)<subscript>6</subscript>Sn<subscript>5</subscript> increased and it transformed into a Cu-substituted (Au,Cu)Sn phase with 25 at.% Cu after 1 min of reflow at 250°C. The x-ray diffraction (XRD) pattern confirmed the phase transformation of Au-substituted (Cu,Au)<subscript>6</subscript>Sn<subscript>5</subscript> to Cu-substituted (Au,Cu)Sn phase. In addition, there was greater Au consumption in the Au/Sn/Cu sandwich joint structure than in the single Au/Sn reaction case, due to some of the Au participating in the opposite Sn/Cu interfacial reaction. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 03615235
- Volume :
- 38
- Issue :
- 11
- Database :
- Complementary Index
- Journal :
- Journal of Electronic Materials
- Publication Type :
- Academic Journal
- Accession number :
- 44513692
- Full Text :
- https://doi.org/10.1007/s11664-009-0920-2