Fine electronic circuit pattern formation on plastic substrates by metal nanoparticle pastes.

The article discusses the formation of electronic circuit plastic substrate, with the use of metal nanoparticle paste, in a micro-conductive pattern to enhance its usability. It focuses on micro-conductive pattern using silver-palladium compound nanoparticle paste, silver nanoparticle paste and copper nanoparticle paste. It is stated that when silver nanoparticles protected by organic material are heated, the organic protective layer is disposed and the particles merge to become a thin film.