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A Performance Tradeoff Function for Evaluating Suggested Parameters in the Reactive Ion Etching Process.

Authors :
Lau, H. C. W.
Tang, C. X. H.
Leung, B. P. K.
Lee, C. K. M.
Ho, G. T. S.
Source :
IEEE Transactions on Systems, Man & Cybernetics: Part A; Jul2009, Vol. 39 Issue 4, p933-938, 6p, 2 Charts, 5 Graphs
Publication Year :
2009

Abstract

Reactive ion etching (RIE) is a process in the fabrication of semiconductor devices. The ability to predict the influence of the process parameters of RIE is crucial in terms of machine performance as they may have a serious impact on product quality as well as on the probability of machine failure. To address this issue, this correspondence paper presents a novel performance tradeoff function for evaluating the overall suitability of adopting the predicted control parameters suggested by domain experts, taking into full consideration their impact on the performance of the machine involved. An experiment using the RIE machine is provided to validate the practicability of the proposed approach. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
10834427
Volume :
39
Issue :
4
Database :
Complementary Index
Journal :
IEEE Transactions on Systems, Man & Cybernetics: Part A
Publication Type :
Academic Journal
Accession number :
43204206
Full Text :
https://doi.org/10.1109/TSMCA.2009.2019877