Keeping Hot Chips Cool: Are IC Thermal Problems Hot Air?

MLA

Puri, Ruchir, et al. “Keeping Hot Chips Cool: Are IC Thermal Problems Hot Air?” DAC: Annual ACM/IEEE Design Automation Conference, Feb. 2008, pp. 634–35. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=36631661&authtype=sso&custid=ns315887.

APA

Puri, R., Varma, D., Edwards, D., Franzon, P., Kosonocky, S., Weger, A. J., & Yang, A. (2008). Keeping Hot Chips Cool: Are IC Thermal Problems Hot Air? DAC: Annual ACM/IEEE Design Automation Conference, 634–635.

Chicago

Puri, Ruchir, Devadas Varma, Darvin Edwards, Paul Franzon, Stephen Kosonocky, Alan J. Weger, and Andrew Yang. 2008. “Keeping Hot Chips Cool: Are IC Thermal Problems Hot Air?” DAC: Annual ACM/IEEE Design Automation Conference, February, 634–35. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=36631661&authtype=sso&custid=ns315887.