3D-SoftChip: A Novel 3D Vertically Integrated Adaptive Computing System.

This paper describes the high-level system modeling and functional verification of a novel 3D vertically integrated Adaptive Computing Systemon- Chip (ACSoC), which we term 3D-SoftChip. The 3D-SoftChip comprises two vertically integrated chips (a Configurable Array Processor and an Intelligent Configurable Switch) through an Indium Bump Interconnection Array (IBIA). This paper also describes an advanced HW/SW co-design and verification methodology using SystemC, which has been used to verify the functionality of the system and to allow architectural exploration in the early design stage. An implementation of the MPEG-4 full search block matching motion estimation algorithm has been applied to demonstrate the architectural superiority of the proposed novel 3D-ACSoC. [ABSTRACT FROM AUTHOR]