Aluminium-based packaging platform for LED using selectively anodising method.

MLA

Kim, K. M., et al. “Aluminium-Based Packaging Platform for LED Using Selectively Anodising Method.” Electronics Letters (Institution of Engineering & Technology), vol. 44, no. 1, Jan. 2008, pp. 24–25. EBSCOhost, https://doi.org/10.1049/el:20081391.

APA

Kim, K. M., Shin, S. H., Lee, Y. K., Choi, S. M., & Kwon, Y. S. (2008). Aluminium-based packaging platform for LED using selectively anodising method. Electronics Letters (Institution of Engineering & Technology), 44(1), 24–25. https://doi.org/10.1049/el:20081391

Chicago

Kim, K. M., S. H. Shin, Y. K. Lee, S. M. Choi, and Y. S. Kwon. 2008. “Aluminium-Based Packaging Platform for LED Using Selectively Anodising Method.” Electronics Letters (Institution of Engineering & Technology) 44 (1): 24–25. doi:10.1049/el:20081391.