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Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents.

Authors :
Jun Hyung Lim
Eui Cheol Park
Seung Yi Lee
Jeong-Won Yoon
Sang-Su Ha
Jinho Joo
Hoo-Jeong Lee
Seung-Boo Jung
Keun Song
Source :
Journal of Electronic Materials; Nov2007, Vol. 36 Issue 11, p1510-1515, 6p, 4 Diagrams, 1 Chart, 3 Graphs
Publication Year :
2007

Abstract

We fabricated a Ni metal mask using the electroforming process, in combination with photolithography, and evaluated the effects of adding wetting agents to the electrolyte on the microstructure and mechanical properties. Photo masking, exposure, and development procedures were used to produce additive patterns on the stainless steel substrate. Subsequently, a textured Ni metal mask (30 µm thickness and 100 µm hole size) was formed on the substrate using the electroforming process. We found that the microstructure and mechanical properties varied considerably with the different combinations of the wetting agents added, i.e., the addition of SF-1, SF-2, or both SF-1 and SF-2. The addition of both wetting agents significantly reduced the grain size, resulting in an improved Vickers's hardness (638 HV) and a reduced surface roughness (11.39 nm). Moreover, the friction coefficient of the Ni mask was reduced to 0.66. The wear resistance of the Ni mask was comparable to that of a commercial stainless steel mask due to the improved hardness and reduced friction coefficient. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
03615235
Volume :
36
Issue :
11
Database :
Complementary Index
Journal :
Journal of Electronic Materials
Publication Type :
Academic Journal
Accession number :
27618313
Full Text :
https://doi.org/10.1007/s11664-007-0211-8