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Fabrication of Ni Metal Mask by Electroforming Process Using Wetting Agents.
- Source :
- Journal of Electronic Materials; Nov2007, Vol. 36 Issue 11, p1510-1515, 6p, 4 Diagrams, 1 Chart, 3 Graphs
- Publication Year :
- 2007
-
Abstract
- We fabricated a Ni metal mask using the electroforming process, in combination with photolithography, and evaluated the effects of adding wetting agents to the electrolyte on the microstructure and mechanical properties. Photo masking, exposure, and development procedures were used to produce additive patterns on the stainless steel substrate. Subsequently, a textured Ni metal mask (30 µm thickness and 100 µm hole size) was formed on the substrate using the electroforming process. We found that the microstructure and mechanical properties varied considerably with the different combinations of the wetting agents added, i.e., the addition of SF-1, SF-2, or both SF-1 and SF-2. The addition of both wetting agents significantly reduced the grain size, resulting in an improved Vickers's hardness (638 HV) and a reduced surface roughness (11.39 nm). Moreover, the friction coefficient of the Ni mask was reduced to 0.66. The wear resistance of the Ni mask was comparable to that of a commercial stainless steel mask due to the improved hardness and reduced friction coefficient. [ABSTRACT FROM AUTHOR]
- Subjects :
- NICKEL
ELECTROFORMING
ELECTROCHEMISTRY
WETTING agents
MICROSTRUCTURE
STAINLESS steel
Subjects
Details
- Language :
- English
- ISSN :
- 03615235
- Volume :
- 36
- Issue :
- 11
- Database :
- Complementary Index
- Journal :
- Journal of Electronic Materials
- Publication Type :
- Academic Journal
- Accession number :
- 27618313
- Full Text :
- https://doi.org/10.1007/s11664-007-0211-8