Design and performance of a 60-GHz multi-chip module receiver employing substrate integrated waveguides.

The design, fabrication and performance of a 60-GHz multi-chip module receiver employing a substrate integrated waveguide filter and antenna are presented. The receiver is integrated onto a single multilayer substrate, fabricated using photo-imageable thick-film technology. The module incorporates a GaAs monolithic microwave integrated circuit low-noise amplifier and downconverter, with lumped elements for intermediate frequency (IF) filtering embedded into the substrate. The chip cavities for mounting of the MMICs are photo-imaged as part of the standard process, giving precise dimensional control for short bond-wire lengths. The complete module including integrated antenna measures only 22.5 mm×5.4 mm×0.3 mm and works from 58 to 64 GHz. [ABSTRACT FROM AUTHOR]