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Enhancement of exchange field in CoFe/IrMn by Os/Cu buffer layer.
- Source :
- Journal of Applied Physics; 5/1/2007, Vol. 101 Issue 9, p09E514, 3p, 4 Graphs
- Publication Year :
- 2007
-
Abstract
- Enhancement of exchange field (H<subscript>ex</subscript>) and thermal stability of the textured CoFe/IrMn with Os/Cu buffer layer and Os diffusion barrier layer were studied. As revealed by x-ray Diffraction (XRD), an Os (0002) surface mesh was observed to form on Cu (100)/Si (100). The growth of CoFe (111)/IrMn (111) on such a template is parallel to the Os (0002). With the Os/Cu buffer layer, the CoFe/IrMn presents an enhancement of 70 Oe on H<subscript>ex</subscript> larger than that without Os/Cu. The H<subscript>ex</subscript> of the textured sample was 230 Oe at room temperature and it was increased to 330 Oe after 250 °C annealing. When the temperature reached 350 °C, H<subscript>ex</subscript> vanished. The increment of the temperature at which the textured and the nontextured sample obtaining their maximum H<subscript>ex</subscript> and the vanishing temperature of H<subscript>ex</subscript> were 50 and 75 °C, respectively. Furthermore, the CoFe/Os (d)/IrMn slowed down the H<subscript>ex</subscript> degradation. The sample with d=0.3 nm obtained its maximum H<subscript>ex</subscript> at 250 °C and vanished when it reached 400 °C. The combination of CoFe/IrMn with Os/Cu buffer layer and Os barrier layer made the H<subscript>ex</subscript> higher and also better thermal stability. [ABSTRACT FROM AUTHOR]
Details
- Language :
- English
- ISSN :
- 00218979
- Volume :
- 101
- Issue :
- 9
- Database :
- Complementary Index
- Journal :
- Journal of Applied Physics
- Publication Type :
- Academic Journal
- Accession number :
- 25115071
- Full Text :
- https://doi.org/10.1063/1.2670324