Bell Labs takes the heat out of chips using coolant on nanograss surface.

MLA

Yeates, Harry. “Bell Labs Takes the Heat out of Chips Using Coolant on Nanograss Surface.” Electronics Weekly, no. 2187, Mar. 2005, p. 26. EBSCOhost, widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=20241312&authtype=sso&custid=ns315887.

APA

Yeates, H. (2005). Bell Labs takes the heat out of chips using coolant on nanograss surface. Electronics Weekly, 2187, 26.

Chicago

Yeates, Harry. 2005. “Bell Labs Takes the Heat out of Chips Using Coolant on Nanograss Surface.” Electronics Weekly, no. 2187 (March): 26. http://widgets.ebscohost.com/prod/customlink/proxify/proxify.php?count=1&encode=0&proxy=&find_1=&replace_1=&target=https://search.ebscohost.com/login.aspx?direct=true&site=eds-live&scope=site&db=edb&AN=20241312&authtype=sso&custid=ns315887.