Filling the Gap: Underfill Materials Dispensing for Electronics.

Subjects

Subjects :

CAPILLARY flow
YOUNG'S modulus
SURFACE preparation
ELECTRONIC equipment
SOLDER joints
FLIP chip technology
SERVER farms (Computer network management)
PRINTED circuit design

Details

Language :

English

ISSN :

19395442

Volume :

41

Issue :

12

Database :

Complementary Index

Journal :

Printed Circuit Design & Fab: Circuits Assembly

Publication Type :

Periodical

Accession number :

181619400