Back to Search
Start Over
接地共面波导与芯片级联结构设计与优化.
- Source :
- Journal of Hebei University of Science & Technology; Aug2024, Vol. 45 Issue 4, p373-380, 8p
- Publication Year :
- 2024
-
Abstract
- <i>Copyright of Journal of Hebei University of Science & Technology is the property of Hebei University of Science & Technology, Journal of Hebei University of Science & Technology and its content may not be copied or emailed to multiple sites or posted to a listserv without the copyright holder's express written permission. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
- Subjects :
- IMPEDANCE matching
ELECTRIC lines
LEAD
PROBLEM solving
SIMULATION methods & models
Subjects
Details
- Language :
- Chinese
- ISSN :
- 10081542
- Volume :
- 45
- Issue :
- 4
- Database :
- Complementary Index
- Journal :
- Journal of Hebei University of Science & Technology
- Publication Type :
- Academic Journal
- Accession number :
- 180511608
- Full Text :
- https://doi.org/10.7535/hbkd.2024yx04004