Improved thermal conductivity of high‐density polyethylene by incorporating hybrid fillers of copper powders and silicon carbide whiskers.

MLA

Yang, Gengchen, et al. “Improved Thermal Conductivity of High‐density Polyethylene by Incorporating Hybrid Fillers of Copper Powders and Silicon Carbide Whiskers.” Journal of Applied Polymer Science, vol. 141, no. 42, Nov. 2024, pp. 1–12. EBSCOhost, https://doi.org/10.1002/app.56099.

APA

Yang, G., Li, Y., Liang, M., Xia, S., Zhou, S., & Zou, H. (2024). Improved thermal conductivity of high‐density polyethylene by incorporating hybrid fillers of copper powders and silicon carbide whiskers. Journal of Applied Polymer Science, 141(42), 1–12. https://doi.org/10.1002/app.56099

Chicago

Yang, Gengchen, Yao Li, Mei Liang, Shuang Xia, Shengtai Zhou, and Huawei Zou. 2024. “Improved Thermal Conductivity of High‐density Polyethylene by Incorporating Hybrid Fillers of Copper Powders and Silicon Carbide Whiskers.” Journal of Applied Polymer Science 141 (42): 1–12. doi:10.1002/app.56099.