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Self‐healing, low oil leakage and recyclable thermally conductive Al2O3/boron nitride@siloxane composites based on reversible dynamic network.

Authors :
Tu, Zhiting
Wu, Weijian
Hao, Zhifeng
Chen, Xiang
Chen, Qiuling
Huang, Xiaonan
Selim, Mohamed S.
Yu, Jian
Source :
Journal of Applied Polymer Science; 11/10/2024, Vol. 141 Issue 42, p1-19, 19p
Publication Year :
2024

Abstract

In order to overcome the commercialized silicone‐based thermal interface materials' issues such as oil leakage and mechanical damage, we developed a thermoset silicone rubber matrix (SR) achieved through the condensation reaction of hydroxyl silicone oil and tetraethyl silicate. Additionally, we constructed a self‐healing and recyclable silicone rubber matrix (SCNR) by incorporating heat reversible ionic and hydrogen bonds between carboxyl and amino functionalized polydimethylsiloxane. Finally, the flexible, low oil leakage, self‐healing, and recyclable composites Al2O3/BN@SR/SCNR was prepared by adjusting the ratio of SR/SCNR and the spherical alumina and boron nitride (BN) fillers. The results indicated that with SR/SCNR mass ratio of 1/0.075 and filler content of 70 wt%, the thermal conductivity of the composite reaches 1.866 W m−1 K−1, 646% increasing over the SR/SCNR matrix. The self‐healing efficiency reaches 97% and the thermal conductivity remains essentially unchanged after being recycled for three times. The composites can be bent and twisted multiple times and still return to their original shape. Notably, the oil leakage of the Al2O3/BN@SR/SCNR composites is significantly lower than that of additive silicone composites. Therefore, the recyclable thermal conductivity composite developed in this study provides a promising solution for improving the durability of heat dissipation materials in electronic devices. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
00218995
Volume :
141
Issue :
42
Database :
Complementary Index
Journal :
Journal of Applied Polymer Science
Publication Type :
Academic Journal
Accession number :
180044927
Full Text :
https://doi.org/10.1002/app.56094