Patent Issued for Electronic package (USPTO 12080466).

A patent has been issued for an electronic package with an inductor structure of a package carrier. The package includes an insulator with spiral inductor circuits embedded in layers, as well as shielding layers to prevent electromagnetic interference. The package also features a build-up circuit structure and electronic elements connected via fan-out conductive copper pillars. The invention aims to address the challenges faced by conventional inductive elements, such as electromagnetic interference and high processing costs. The patent was filed by Hsu, Che-Wei and assigned to Phoenix Pioneer Technology Co. Ltd. [Extracted from the article]