Cite
Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature.
MLA
Zhao, Xiangxi, et al. “Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature.” Journal of Materials Engineering & Performance, vol. 33, no. 16, Aug. 2024, pp. 8236–41. EBSCOhost, https://doi.org/10.1007/s11665-023-08532-x.
APA
Zhao, X., Zhang, W., Liu, W., Hang, C., & Tian, Y. (2024). Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature. Journal of Materials Engineering & Performance, 33(16), 8236–8241. https://doi.org/10.1007/s11665-023-08532-x
Chicago
Zhao, Xiangxi, Wei Zhang, Wei Liu, Chunjin Hang, and Yanhong Tian. 2024. “Effect of Ag3Sn on Fracture Behaviors of Sn-3.5Ag Lead-Free Solder during In Situ Tensile Test at Low Temperature.” Journal of Materials Engineering & Performance 33 (16): 8236–41. doi:10.1007/s11665-023-08532-x.