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A Residual Stress-Based Model for Viscoplastic Self-Consistent Simulation of Cold-Sprayed Al6061.

Authors :
Paudel, YubRaj
Williams, Aulora
Mujahid, Shiraz
Pepi, Marc
Czech, Peter
Rhee, Hongjoo
El Kadiri, Haitham
Source :
Journal of Materials Engineering & Performance; Aug2024, Vol. 33 Issue 15, p7744-7754, 11p
Publication Year :
2024

Abstract

Cold spray additively manufactured (CSAM) aluminum 6061 components are characterized by heterogeneous compressive residual stresses induced during manufacturing. This heterogeneity is further compounded by spatial variations in microstructures and mechanical properties, leading to poor inter-particle (intersplat) bonding and significant marring of overall component performance. Thermal post-processing is a keenly researched method for recovering mechanical toughness by enhancing intersplat bonding and altering highly concentrated residual stress distributions. The current work incorporates a modified microscale–mesoscale material model into a viscoplastic self-consistent simulation framework to capture material response in the as-sprayed and post-processed states. The updated model incorporates physically informed parameters emphasizing residual stresses measured experimentally through X-ray diffraction. The model calibrated using experimental tests and published literature was able to predict the stress–strain response of CSAM parts at post-heat-treated conditions. Results of the parametric study showed the significance of intersplat boundary effects on the overall yield and strain hardening of the CSAM parts. Without any information on the processing conditions of CSAM parts, the modified plasticity model predicted the deformation response using information gathered from microstructure characterization. [ABSTRACT FROM AUTHOR]

Details

Language :
English
ISSN :
10599495
Volume :
33
Issue :
15
Database :
Complementary Index
Journal :
Journal of Materials Engineering & Performance
Publication Type :
Academic Journal
Accession number :
179067060
Full Text :
https://doi.org/10.1007/s11665-024-09572-7