Virtual Metrology of Critical Dimensions in Plasma Etch Processes Using Entire Optical Emission Spectrum.

MLA

Dailey, Roberto, et al. “Virtual Metrology of Critical Dimensions in Plasma Etch Processes Using Entire Optical Emission Spectrum.” IEEE Transactions on Semiconductor Manufacturing, vol. 37, no. 3, Aug. 2024, pp. 363–72. EBSCOhost, https://doi.org/10.1109/TSM.2024.3416844.

APA

Dailey, R., Bertelson, S., Kim, J., & Djurdjanovic, D. (2024). Virtual Metrology of Critical Dimensions in Plasma Etch Processes Using Entire Optical Emission Spectrum. IEEE Transactions on Semiconductor Manufacturing, 37(3), 363–372. https://doi.org/10.1109/TSM.2024.3416844

Chicago

Dailey, Roberto, Sam Bertelson, Jinki Kim, and Dragan Djurdjanovic. 2024. “Virtual Metrology of Critical Dimensions in Plasma Etch Processes Using Entire Optical Emission Spectrum.” IEEE Transactions on Semiconductor Manufacturing 37 (3): 363–72. doi:10.1109/TSM.2024.3416844.