Cite
Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions.
MLA
Liu, Yuexiao, et al. “Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions.” Electronic Materials Letters, vol. 20, no. 5, Sept. 2024, pp. 517–24. EBSCOhost, https://doi.org/10.1007/s13391-024-00491-2.
APA
Liu, Y., Li, C., Chen, P., Liu, J., Hu, A., & Li, M. (2024). Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions. Electronic Materials Letters, 20(5), 517–524. https://doi.org/10.1007/s13391-024-00491-2
Chicago
Liu, Yuexiao, Chongyang Li, Peixin Chen, Jinyang Liu, Anmin Hu, and Ming Li. 2024. “Effect of Co-W and Co-Fe-W Diffusion Barriers on the Reliability of the Solder/Cu Interface during Reflow Conditions.” Electronic Materials Letters 20 (5): 517–24. doi:10.1007/s13391-024-00491-2.